Producing high quality glass wafers for MEMS, AR/VR/MR, Semiconductor, Microlithography, Silicon Bonding and Structured Glass applications requires high-resolution, 100% defect detection at each critical process stage from IQC through coating, micro-machining and via creation. Particles of only a few microns or poorly machined vias can mean reduced quality and yield.
Dark Field has developed and proven on-line, high-speed inspection and measurement technologies which detect defects and provide real time measurements, including immediate grading, alarms and reject actions, in a compact system which can be integrated with a cassette/robot system for immediate G/NG grading.
Contract Inspection allows your team to deploy Dark Field’s inspection expertise even in the early days of product and process development.
Turnkey tabletop inspection systems allow pilot lines, Labs and R&D operations to start using SSLR technology early in the product/process development. Systems are modular and may be repurposed to the production line in the future. This means that the Lab or Pilot Line results are directly transferrable to Production.
The world’s most advanced technology solution for finding defects and taking measurements in RTR, Sheet and Wafer Production. On-line defect detection to 1µm. Achieve greater throughput, improved quality, minimize scrap, eliminate manual labor, and improve costs – concurrently.
New processes and pilot plants sometimes require a stand-alone, special turnkey system. Dark Field turnkey systems deliver recipe-based defect detection and metrology for all process operations. Systems include XYZ stages and requisite safety interlocks and controls. This system may later be repurposed for Production.
As processes and products change or evolve, Dark Field systems may be upgraded for wider and faster operations, greater system resolution and customized software. Dark Field systems are completely modular so they can be upgraded in the field.