AR, VR, & MR Headset Production

Post Coating of Headset Optics – Quality, Yield and Throughput Challenges 

• Manual inspection is time consuming, expensive, subjective and inexact; critical defects cannot be reliably detected, manually.  Manual handling adds to the defects and yield loss. 
• Production line speeds, limited line access and the need to find very small defects make manual inspection impossible. 
• Conventional camera technologies do not deliver consistent high-speed inspection of first surface or both surfaces. 

Dark Field Solutions 

• Specially designed Solid State Laser Reflection (SSLR) scanners deliver the highest resolution in the industry (1μm); darkfield and brightfield scanner designs.   
• Special technology for first surface inspection or transmission inspection.   Edge defect and chamfer defect detection.  Inspect time 1-2 seconds per wafer. 
• Self-aligning optics means no more false hits or missed defects due to misalignment. 

Process Challenges

• Pilot plant operations need a means to determine cause and effect of changing process parameters in a simple “Push button” operation.
• Process and customer-specific turnkey solutions are required for process optimization.
• Building a cost-effective turnkey solution is not within the remit or expertise of inspection and metrology companies.

Dark Field Turnkey Solutions

• Customer and process-specific turnkey solutions are routinely designed and built by Dark Field Technologies.

Information, not just data: Mapping, Reporting, Warnings and Trending

Information Challenges

• Conventional inspection systems produce megabytes of data and images but do not generate useful information
• Conventional systems require constant attention and tuning

Dark Field Solutions

• Defect mapping, alarms and marking
• Feature measurement and placement; Upper and Lower Control Limits
• Customer specific reports and trends
• No maintenance; the only self-aligning, production-worthy optical system in the world